In the electronics manufacturing industry, the miniaturization of components and the increasing assembly density have made it difficult for traditional inspection methods to accurately detect internal solder joints and complex structural defects. Achieving reliable and efficient quality control in high-volume, high-paced production environments has become a pressing industry challenge.

Seamark AXI9000 High-Speed CT-Type X-ray fully automated X-ray inspection equipment was developed to meet this demand. With stability, practicality, and high efficiency as its core features, it is committed to providing reliable inspection solutions for SMT, semiconductor packaging, and precision electronic assembly.

High speed and high quality, balancing efficiency and accuracy

The equipment adopts a linear motor drive and a three-layer gantry structure, combined with grating ruler positioning, to achieve high-speed CT scanning while ensuring motion accuracy. Its unique 3D/CT reconstruction technology enables high-speed inspection, with an inspection time of less than 2 seconds per field of view, significantly improving inspection efficiency and adapting to the demands of high-paced production lines.

Wide range of detection capabilities, applicable to multiple scenarios

The AXI9000 boasts broad device compatibility, capable of inspecting various packaged components, including BGA, CHIP, QFN, DIP inserts, and IGBTs. In defect detection, it can accurately identify typical process issues such as missing components, misalignment, solder bridging, open circuits, insufficient solder, voids, and head in pillow (HIP).

Whether it's semiconductor back-end packaging chips, or SMT processes such as automotive electronics, communication modules, mobile phone motherboards, and flexible printed circuit boards, this equipment can provide stable and reliable testing support.

Intelligent algorithms improve detection efficiency

The equipment is equipped with a self-developed intelligent detection algorithm and has the following features:

Height H positioning algorithm: Improves adaptability to the detection of components at different heights;

AI super-resolution fusion technology: enhances image details and assists in accurate judgment;

Automatic parameter setting for testing: Reduces reliance on operator experience and improves debugging efficiency.

Digital management, remote control

The equipment supports system configuration, four-point alignment, and remote control functions, making it easy to integrate into intelligent manufacturing systems and achieve data traceability and process optimization.

Safety design, controllable radiation

In terms of safety, the AX19000 adopts a radiation safety interlock design, with a radiation safety interlock of<0.5μSv/h, which is far below the international safety standard. It also uses a multi-process verification mechanism to ensure the operational safety of the equipment during operation.   

Seamark AXI9000 is committed to finding the best balance between speed, accuracy and coverage. It does not overemphasize the ultimate in a single indicator, but focuses on the actual inspection needs of the production line, providing a reliable, practical and easy-to-integrate X-ray inspection solution.