In the fields of precision manufacturing and electronics manufacturing, traditional inspection methods often face problems such as low efficiency, limited accuracy, and over-reliance on personnel experience. They are unable to cope with the rapid and accurate identification of complex internal structures and tiny defects, affecting product quality and production efficiency.

For this reason, the X6600 Offline X-Ray Inspection Equipment from Seamark was born. As a universal offline precision micro-focus X-ray intelligent inspection system, the X6600 is dedicated to providing high-resolution, multi-angle, and large-area inspection support for intelligent manufacturing, helping companies to easily address various complex quality control requirements.

Widely applicable, precise imaging

The Seamark X6600 boasts high magnification and high-resolution imaging capabilities, clearly revealing product internal structural details and adapting to a wide range of inspection targets, from electronic components to complex assemblies.

Its amorphous silicon flat-panel detector, coupled with a resolution of 5.8 Lp/mm, ensures that even subtle anomalies can be captured within a 130mm x 130mm field of view, providing a reliable basis for defect inspection.

Intelligent software, image enhancement

The device is equipped with proprietary intelligent inspection software, combined with new image enhancement processing and preset filter algorithms, to effectively optimize image quality and assist operators in quickly identifying target areas.

Automatic centering and auto-following functions further simplify the operation process, reduce human intervention, and ensure that the inspection area is always in the center of the field of view, improving inspection consistency and efficiency.

Flexible testing, high efficiency in batches

To accommodate batch inspection tasks, the Seamark X6600 offers two CNC inspection modes: free point and matrix, enabling fast, standardized scanning of similar products.

Furthermore, the device supports multi-angle analysis, facilitating observation of an object's internal structure from various perspectives and providing multi-dimensional information for identifying complex defects such as cracks, broken wires, and offsets.

Intelligent analysis, automatic identification

In terms of defect identification, the Seamark X6600 can automatically identify common process issues such as dimensional anomalies, solder bridging, and broken wires. It also supports fully automatic bubble ratio calculation, making it suitable for rapid evaluation of precision solder joints such as BGA solder balls. After inspection, the system automatically generates standardized reports to facilitate data traceability and analysis optimization.

For specific scenarios, Seamark X6600 also provides customized AI intelligent inspection algorithms. It can develop specific software algorithms based on the specific characteristics of user products to achieve fully automatic defect identification and inspection.

Seamark X6600 X-Ray Offline Inspection Equipment, with its robust performance, flexible configuration, and intelligent functions, provides companies with reliable inspection tools for quality control, helping them to steadily improve product quality and production efficiency.

Consult Seamark now to get exclusive customized solutions for your products!