As SMT components become increasingly miniaturized and dense, traditional inspection methods face severe challenges: tiny components are prone to missed inspections, two-dimensional inspections have difficulty identifying three-dimensional defects such as floating height and solder, and cumbersome debugging affects production line efficiency, restricting further improvements in product quality and production efficiency.

To address these industry pain points, Seamark S3030 3D Automatic Optical Inspection Equipment came into being. Through innovative technology integration, it provides new solutions for the SMT inspection process.

Multi-dimensional perception, breaking through inspection blind spots

The device utilizes "2D+3D fusion inspection" technology, which uses a four-way, low-angle 3D projection system to capture 3D data of components and solder joints, combining it with 2D planar information to create a more complete inspection view.

This multi-dimensional inspection approach helps reduce inspection obstructions caused by close component spacing, enabling more accurate identification of common defects such as missing parts, offsets, and floating heights.

Efficient imaging, balancing speed and precision

The 12-megapixel high-resolution industrial camera (optional 21-megapixel) combined with CoaXPress high-speed transmission technology theoretically improves inspection speed compared to traditional transmission methods.

This configuration helps maintain production line tact while ensuring image quality, meeting the efficiency requirements of modern electronics manufacturing.

Flexible adaptation to cope with complex production environments

The equipment comes standard with a Z-axis module that can compensate for a certain range of board deflection, which may be practical for processing deformed substrates.

Furthermore, the combination of a multi-angle RGBW light source system and a telecentric lens is expected to improve imaging consistency and support inspection stability.

Intelligent integration empowers digital production

Support for offline programming allows program creation and debugging to be performed without disrupting production line operations.

The equipment can also be connected to MES systems and can be equipped with an optional artificial intelligence inspection module, expanding its ability to inspect special defects such as solder balls and surface scratches before the furnace, providing an access point for intelligent manufacturing data flow.

Seamark S3030, through its core 2D+3D fusion inspection technology, high-speed, high-resolution imaging system, and intelligent offline programming and MES integration capabilities, provides a promising solution for meeting the challenges of miniaturization, high density, and high efficiency in modern SMT production. Choosing the S3030 may be a key step towards a higher level of process quality control and intelligent manufacturing management.

Consult Seamark now to get exclusive customized solutions for your products!