In the era of high-density and miniaturized electronics manufacturing, SMT processes face severe quality challenges. Traditional 2D inspection struggles to cope with complex conditions such as component obstruction, varying solder joint heights, and board warping. Missed inspections and false positives are common, impacting pass rates and posing a significant risk to product reliability.

To address these problems, the S3030 3D automatic optical inspection equipment redefines SMT online inspection standards with multi-dimensional fusion inspection and intelligent hardware architecture.

Industry Pain Points and Innovative Solutions

High-density Components Are Severely Obstructed

The S3030 uses a 4-way small-angle 3D projection system to obtain three-dimensional data of components and solder joints through multi-angle imaging, effectively reducing visual occlusion of small-pitch components.

High Misjudgment Rate of Plate Bending and Warping

The equipment is equipped with a standard Z-axis module, which can perform real-time compensation for a wide range of plate bending and adapt to different plate thicknesses and deformation conditions of 0.4-6mm.

Inspection Speed Cannot Keep Up with the Pace

Equipped with a 12-megapixel high-speed camera and CoaXPress transmission technology, it increases speed by 40% compared to traditional interfaces, achieving efficient inspection.

Programming Takes up Production Line Time

Supports offline programming, program creation and debugging are carried out independently, greatly reducing the time equipment takes up in production.

Outstanding Functional Features

2D+3D Fusion Inspection: Accurately capture planar and three-dimensional defects

Multi-angle RGBW Light Source: Improve imaging consistency

AI Inspection Extension: Supporting complex defect identification

MES System Docking: Real-time analysis of quality data

Comprehensive Inspection Capabilities

Component Defect Inspection：Missing parts, offset, reverse, floating, sideways, monument, etc.

Solder Joint and Workmanship Defects：Poor solder joints, tin balls, oxidation contamination, foreign matter, scratches

Optional AI Inspection Function：Pre-oven tin balls, scratches on the gold surface,  solder contamination on the gold surface, tin stains, tin balls, foreign matter

Seamark S3030 3D automatic optical inspection equipment is not only a inspection tool, but also a strategic partner for you to improve yield, reduce rework costs, and achieve quality upgrades.