In electronics manufacturing, semiconductor packaging, automotive electronics, and other fields, the increasing complexity of product internal structures and miniaturization of devices are increasingly challenging quality inspection.

Traditional inspection methods struggle to address defects such as high-density packaging, hidden cracks, and poor tin penetration. This is especially true when performing non-destructive imaging on thick materials and multi-layer substrates. Conventional equipment often lacks penetration and produces blurred images, leading to increased missed inspection rates and severely impacting product reliability and production efficiency.

To address the above problems, Seamark has launched the X6600B offline precision micro-focus X-ray inspection equipment, which is centered on high penetration, high resolution and intelligent imaging algorithms, providing enterprises with a one-stop, high-quality inspection solution.

High-penetration and high-resolution imaging

Seamark X6600B utilizes a reflective sealed microfocus X-ray source with a tube voltage of up to 130KV and a maximum output power of 39W. Combined with a 5μm microfocus design, it maintains image clarity even at high magnifications.

The device supports a spatial resolution of 5.5Lp/mm and a 16-bit AD conversion bits, clearly demonstrating internal defects. Even with high-density components or low-contrast defects, images remain sharp and distinct.

Intelligent AI algorithm recognition

The device is equipped with a proprietary intelligent imaging system, new image enhancement processing, and preset filter algorithms that automatically optimize imaging and significantly improve defect recognition.

Users can also customize AI inspection algorithms based on product characteristics to automatically identify and classify specific defect types, significantly reducing reliance on manual experience.

Multi-angle inspection, CNC batch operation

The Seamark X6600B is equipped with an optional rotating stage, allowing users to analyze the internal structure of samples from any angle and inspect product defects.

Furthermore, the device features a CNC mode that supports both free-point and matrix path settings for multi-point inspection of batch samples, automatically saving images and generating structured reports.

Multiple safety protections ensure safe and reliable operation

The equipment has passed the national radiation safety certification and complies with multiple Chinese and international safety standards, with radiation levels far below the required limits. The system integrates multiple protection mechanisms: real-time radiation monitoring, security door interlocks, fingerprint access management, and automatic power off when idle.

With its precise imaging capabilities, intelligent inspection processes, and comprehensive safety features, the X6600B from Seamark has become an indispensable quality control tool in high-reliability manufacturing.