In high-end electronics manufacturing, BGA rework has long faced challenges in precision, efficiency, and reliability. Misalignment in traditional equipment can easily damage pads, inadequate electrostatic protection can lead to hidden chip failures, and uneven temperature control across multiple temperature zones can cause cold solder joints and short circuits. Furthermore, manual operations rely heavily on experience, lack data traceability, and are difficult to adapt to large boards, severely hindering production efficiency and intelligent upgrades.

Seamark has launched the ZM-R8650C intelligent BGA rework equipment, which provides a strong rework guarantee for high-end electronic manufacturing with a fully automatic, high-precision and traceable solution.

High-Precision Vision Alignment and Motion Control

Equipped with a 2-megapixel high-definition industrial camera system and proprietary vision software, the system automatically corrects skew and angle, achieving a repeatable alignment accuracy of ±0.025mm.

Utilizing an industrial PC and servo motion control system, the X/Y/Z four-axis gantry structure and a ground marble platform deliver positioning accuracy of ±0.01mm, ensuring precise placement of both micro-components and large panels.

Three Independent Closed-loop Temperature Control Zones

The three independently programmable temperature zones feature convection heating in the upper and lower zones, while the preheating zone features a German-imported medium-wave ceramic infrared heating plate. High-precision K-type thermocouples, combined with dynamic PID multi-loop closed-loop control, achieve ±1°C temperature control accuracy, ensuring a stable and controllable temperature profile during the welding process.

Efficient Large Board Processing Solution

The ZM-R8650C, with its stable performance and flexible configuration, is widely applicable for the rework of components such as 5G communication boards, server motherboards, and automotive electronic control modules. Supported Devices:

PCB Size: Maximum 660x600mm, Minimum 10x10mm

Applicable Chips: Maximum 100x100mm, Minimum 1x1mm

Positioning Method: L-slot and universal fixture (customizable custom fixtures)

Comprehensive ESD Protection Design

A built-in ion blower and anti-static work surface effectively eliminate static electricity on the board surface, reducing the risk of ESD damage and providing comprehensive protection for sensitive components.

Smart Manufacturing Data Integration

Optional MES system integration supports temperature profile analysis with S/N traceability, process parameter recording, and production data management, ensuring full data traceability throughout the repair process.

Seamark ZM-R8650C intelligent BGA rework workstation provides electronic manufacturing companies with full-process support from "problem solving" to "efficiency improvement" through technological breakthroughs in core aspects such as precision, temperature, and electrostatic protection. The ZM-R8650C will become a key equipment for companies to improve product quality and reduce production costs, helping the industry move towards a higher-precision manufacturing future.

Consult Seamark now to get exclusive customized solutions for your products！