In the SMT production process, component and solder joint inspection before and after the furnace is a key link in ensuring product yield. Faced with the inspection needs of high-density and miniaturized components, traditional inspection equipment is easily affected by obstructions, lacks accuracy or lags in efficiency.

Seamark S3030 3D automatic optical inspection equipment, with "2D+3D fusion inspection" as its core, is equipped with a high-resolution visual system and flexible adaptation design to provide SMT production lines with stable and accurate automated inspection solutions.

2D+3D Fusion Inspection:

Seamark S3030 uses "2D+3D fusion inspection" technology, which obtains three-dimensional data of components and solder joints through a 4-way small-angle 3D projection system, and combines 2D plane information to achieve all-round inspection. It can eliminate the occlusion problem of small-pitch components to a greater extent, and is especially suitable for the inspection scenarios of high-density and miniaturized components.

Whether it is solder balls and scratches on the gold surface before the furnace, or poor solder joints and floating components after the furnace, the equipment can accurately identify common SMT defects such as missing parts, offset, reverse, sideways, tombstones, oxidation pollution, foreign matter, scratches, etc., reducing the flow of defective products to the next link from the source.

High Resolution and Efficient Inspection:

The device is equipped with a 12-megapixel industrial camera (21-megapixel optional) with a resolution of 5μm/10μm/15μm, which can clearly capture subtle defects.

At the same time, the equipment is equipped with an RGBW LED lighting system, which, combined with multi-angle light sources and telecentric lenses, can optimize the imaging effects of components of different materials and colors, further improve inspection accuracy, and reduce misjudgments and missed judgments.

Plate Bending Compensation and Flexible Adaptation:

To address the common problem of substrate bending in SMT production, Seamark S3030 comes standard with a Z-axis module that can compensate for a large range of substrate bending, ensuring stable inspection accuracy even if the substrate has slight deformation.

In terms of substrate adaptation, the device supports a maximum substrate size of 510*460mm, a substrate thickness covering 0.4-6mm, a board edge size of 3mm, an upper and lower board height of 45mm, and a track height of 900±50mm. It can also measure components up to 30mm in height, which can meet the substrate specification requirements of most SMT production lines without the need for frequent adjustment of basic equipment parameters.

Offline Programming and Intelligent Docking:

To reduce the impact of equipment debugging on the production line, Seamark S3030 supports offline programming - program creation and debugging can be completed offline without occupying the production line's operating time, reducing downtime losses.

In terms of smart factory docking, the equipment can be directly connected to the MES system, facilitating real-time uploading and traceability of production data, helping enterprises achieve digital control of the production process and improving the collaborative efficiency of the overall production line.

From the precise identification of high-density components to the coordinated improvement of production line efficiency, Seamark S3030 3D automatic optical inspection equipment is designed to fit the actual SMT production, covering the entire inspection scene before and after the furnace, providing reliable quality assurance for SMT production lines in various fields, helping companies to improve yield while realizing automation and digital upgrades in the inspection process.