In industries such as electronics manufacturing, semiconductor packaging, new energy, and precision components, nondestructive testing of product internal structures has always been a critical step in quality control.
Faced with the high-precision inspection demands for hidden defects in BGA solder joints, internal cracks in chips, and component misalignment, traditional inspection methods often suffer from insufficient image resolution, low efficiency, excessive reliance on manual labor, and a lack of intelligent interpretation. These methods struggle to balance efficiency and accuracy, severely impacting production line reliability and standardization.
Against this backdrop, the X6600 offline precision micro-focus X-ray inspection system from Seamark was developed. Combining high-resolution imaging, a multifunctional inspection platform, and intelligent image algorithms, the system is dedicated to providing companies with cost-effective, stable, and reliable offline X-ray inspection solutions, significantly improving quality control capabilities.
Use core technologies to address typical detection challenges:
High resolution and wide range imaging
The device is equipped with an amorphous silicon flat-panel detector with a 1536×1536 pixel matrix and a spatial resolution of 5.8Lp/mm. Combined with a large field of view of 130mm×130mm, it can clearly present various defects such as bubbles inside solder joints, chip cracks, and broken wires, greatly reducing missed judgments and misjudgments.
Intelligent algorithms enable automatic defect recognition
The built-in self-developed AI detection algorithm can automatically identify common problems such as dimensional deviation, solder bridging, wire breakage, and offset. It can also customize special recognition models based on customer product characteristics to effectively meet the flexible production needs of multiple varieties and small batches.
Full process automation improves detection efficiency
Supporting CNC programming control, it can perform single-point or matrix batch inspection. Combined with automatic centering and image tracking functions, it reduces repetitive operations. The system automatically calculates the BGA bubble rate and generates a structured inspection report, truly achieving "one-click inspection."
Multi-angle observation and flexible control
The equipment supports multi-angle rotation detection of samples, and is particularly suitable for three-dimensional defect analysis of complex structures such as high-density interconnect packaging and multi-layer PCBs, providing a reliable basis for process improvement.
Comprehensive protection, worry-free operation:
Seamark X6600 has multiple protection mechanisms including real-time monitoring of radiation dose, safety interlock, and automatic power shutdown when idle. It complies with industrial safety standards and ensures the safety of operators and the production environment.
Widely applicable to precision testing in multiple industries:
From electronic welding quality to the internal structure of semiconductor packaging, from new material research and development to micro-component production, Seamark X6600, with its microfocus X-ray source (focus size 10μm, voltage 0-90kV) and large-size stage (540mm×440mm), can meet the needs of various offline inspection scenarios, helping companies achieve high-quality, standardized and intelligent quality inspection processes.
Seamark X6600 offline precision X-ray inspection equipment, with its high-resolution imaging, intelligent algorithms, and flexible detection capabilities, directly addresses the core demands of modern industrial quality inspection for accuracy, efficiency, and reliability.
